The purpose of the scholarship is to support and provide educational opportunities for deserving and outstanding young Malaysians
To provide graduate-employability and serve as a talent supply chain for developing young leaders for the Group.
POLICY The scholarship is open to financially needy and academically inclined Malaysian students including children of employees who are currently pursuing or intend to pursue a full time first Degree in local public / private universities in any of the following disciplines:
Built Environment (Quantity Surveying / Land Surveying / Building @ Construction Management)
Engineering (Civil and Structure)
Engineering (Chemical, Mechanical, Electrical).
Environmental Management
Courses related to construction
ELIGIBILITY
Malaysian citizen aged 24 years and below.
Applicants currently waiting for admission or already admitted to pursue a full time Bachelor’s degree in local public / private university.
The public / private university must have been established under the Universities and University College Act 1971 (Act 30), Universiti
Technologi Mara Act 1976 (Act 173) or the Private Higher Education Institutions Act 1966 (Act 555).
1st year students in the 1st semester are encouraged to apply.
Applicants must achieve the following pre-university qualifications.
SPM: minimum 5As, or STPM: minimum 2As + 3Bs, or Matriculation / Diploma / A-Levels: minimum CGPA 3.00
Current 1st, 2nd,3rd or 4th (Final) year university students minimum CGPA 3.00
Applicants with outstanding extra-curricular record will have an added advantage.
Family (parents or guardians) household income not exceeding RM10,000 per month.
APPLY NOW
All scholarship application forms and supporting documents can be submitted via post or courier service to our head office address or online
Applications are to be completed with the following required information. Incomplete applications will be rejected.
Personal Particulars
Educational Background
Information on Course Applied / Current Course
Parents / Guardian Particulars
Siblings Background
Other Scholarship Applied
Applicants must submit the following supporting documents with their application forms which can be downloaded by logging into www.llc-bhd.com.my
Passport-sized photograph not more than 6 months old & copy of MyKad
Education certificates (SPM, STPM / A-Level and / or Diploma certificates, university acceptance / offer letter, latest CGPA, etc.)
Applicants’ co-curricular / extra-curricular activities, achievement and certificate.
Parent’s / Guardian’s Income tax J-Form / Payslip / Pension Card / Parent(s) Death Certificate.
Only shortlisted applicants will be notified via TELEPHONE for an interview hence, please ensure Your telephone number is accurate and contactable.
TERMS & CONDITIONS
1.0
:
The LLC Scholarship Programme
The LLC Scholarship Programme is an annual programme to support and provide educational opportunities for deserving outstanding young Malaysians.
We provide graduate-employability whereby these young graduates will be mentored and trained to become our young leader.
Full tuition fees and living expenses for successful applicant amounting to RM90,000 for full degree course or RM30,000 per academic year (up to 3 years) or RM22,500 per academic year (up to 4 years) depend on the related full degree course duration.
Willing to serve the Company for 3 years upon graduation.
Must complete the full degree course and achieve min CGPA of 3.00 per academic year to maintain the scholarship.
2.0
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General Terms and Conditions
2.1
:
Field of Study
The scholarship is open to financially needy and academically Malaysia students including children of LLC employees who are currently pursuing or intend to pursue a full time First Degree in local public/private universities in any of the following disciplines:
Built Environment (Quantity Surveying/Land Surveying/Building @ Construction Management)
Engineering (Civil and Structural)
Engineering (Chemical, Mechanical, Electrical)
Environmental Management
Courses related to construction
2.2
:
Eligibility
Malaysia citizen aged 24 years and below.
Applicants currently waiting for admisdsion or already admitted to pursue a full-time degree course in local public/private university.
Applicant currently in their 1st, 2nd, 3rd or 4th (Final) yrs of undergraduate studies is allowed to apply.
Applicants must achieve the following pre-university qualifications:
SPM: min 5As, or STPM: min 2As + 3Bs, or Matriculation/Diploma/A-Level: min CGPA 3.00
Current 1st, 2nd, 3rd or 4th (Final) yrs university students: min CGPA 3.00
Applicants with outstanding extra-curricular record will be advantageous.
Family household income not exceeding RM10,000 per mth..
Applicant is allowed to keep the curent scholarship, loan or financial aids provided NOT been bonded by any other organizations.
Successful applicants and 2 respective guarantors are required to enter the bond agreement with the Company.
All decision made by the Committee are final. No appeals will be entertained.
Only short-listed applicants will be notified by telephone call for an interview.
The short-listed applicants must bring along his/her original certificates during the interview.
3.0
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FAQ
3.1
:
Do I need to be accepted by a university before apply? No, applicants who are awaiting admission/acceptance to a university may also apply as scholarships will be awarded once applicants have gained acceptance to the university.
3.2
:
What are the unievrsities accepted by LLC? Local public or private universities - Tier 4 & 5 as in SETARA listing. You may verify your course via the following links: Malaysian Qualifications Agency at http://www.mga.gov.my/.
3.3
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Do you accept manual application? We accept the hard copy via post or courrier service to our head office address or online application at www.llc-bhd.com.my
3.4
:
Am I allowed to switch my area of study? No.
3.5
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Can I accept additional financial aid from other organizations after I have been awarded the LLC scholarship? Yes, you are allowed to keep your PTPTN, loan or financial aids, or scholarship provided you are not bonded by any other organizations.
3.6
:
Do I entitle to the full scholarship of RM90K if I apply the said scholarship in year 4 (1st semester) of my degree course related to construction?
Yes, we will release the balance of scholarship for year 1, year 2 & year 3 (total RM76,500) to you after you join company.
3.7
:
Is there any bond and for how long?
Yes, a scholar will need to serve a 3 years bond with LLC Group.
3.8
:
When can I check my application status? You will be notified by telephone call followed by letter of scholarship award after attended the interview. Therefore, please ensure that all contact details provided in the application form are accurate.